AMD recently in Taiwan, Taipei held 「introduction AMD Technology Forum and Exhibit (AMD TFE) 」, during this Conference the company first announced plans to launch next year for mainstream PC's CPU 「introduction Llano 」, and had run at the scene, at the same time, the company exhibited for the first time publicly the Llano die, through this exhibition, you can see, contray to be more emphasis on the Llano GPU performance.

From the end of this year to next year, AMD will launch three new series CPU.

The initial launch of the new low-end market oriented architecture 「introduction Bobcat 」. Next year will be launching a new high-end market 「introduction Bulldozer 」 microprocessor architecture. At the same time in the first half of next year will be launched for the mainstream market CPU Llano. In this way we can see that AMD company in 2011 competition strategy.

AMD schema comparison

In the three new series CPU, Bobcat and Bulldozer microprocessor architecture had to be held in the month of August, 「introduction Hot Chips 」 on external display, both at the September Intel Developer Forum (IDF) during the General Assembly, AMD also announced a Bobcat.

As for the Bulldozer through GLOBALFOUNDRIES released the core photos. In addition to the Llano February IEEE International Solid-State Circuits Conference Conference published some technical details, otherwise you don't know anything about it.

The AMD company Executive Chris L.Cloran (Corporate Vice President and General Manager, Computing Solutions Group, Client Division, AMD) officially demonstrates Llano die, and be running the show.

In this presentation, carried out a PI Llano score calculation, Blu-ray playback, simulation based on GPU by n-Body. Your time is very short, but enough to show that the number of tasks and Llano versatility.

Handheld Llano wafer of Chris L. Cloran (Corporate Vice President and General Manager, Computing Solutions Group, Client Division, AMD)

AMD TFE, Llano run demo